✦ Luna Orbit — Engineering (Non-Software)

Advanced Packaging Module Development Engineer

at Intel

📍 US, Arizona, Phoenix Hybrid 💰 $133K – $188K USD / year Posted April 04, 2026
Salary $133K – $188K USD / year
Type Full-Time
Experience mid
Exp. Years 4+ yrs
Education Bachelor's degree in Mechanical Engineering, Chemical Engineering, Manufacturing or Process Engineering, Materials Science, Physics, Chemistry, or a closely related field
Category Engineering (Non-Software)
Experience with process developmentequipment adjustmentand manufacturing process controlDesign of experiments (DoE) principles and statistical data analysisExperience in process characterization and statistical process control methodologiesAnalytical skills and experience troubleshooting integrated technology issues
Master's degree with 3+ years or PhD with 0 years in related fieldProficiency in statistical toolsMicrosoft Office software suite applicationsand process control software/frameworksExperience with organic and inorganic materials in packaging processes
Process developmentEquipment adjustmentManufacturing process controlDesign of Experiments (DoE)Statistical data analysisStatistical process controlProcess characterizationDSCTGAD/TMAICPMSFTIRSEMCross-functional collaborationPackaging technologiesPanel level processesData-driven problem solvingAnalytical skills
OwnershipAccountabilityData-driven decision makingCommunicationAdaptableContinuous learning
Industry Semiconductor
Role Subtype Packaging Engineer
Advanced Packaging Module Development EngineerIntelPhoenixHybrid4+ yearsProcess developmentEquipment adjustmentManufacturing process controlDoEStatistical data analysisStatistical process controlProcess characterizationDSCTGAD/TMAICPMSFTIRSEMPanel level processesCross-functional teamspackaging technologiesqualityreliabilitycostyieldstatistical methodologiesdata-drivenadvanced packagingmodule developmentstatistical process controlpanel level processescross-functional
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