Position Details
About this role
Device Engineer responsible for architecture and hardware development of next-gen HMI modules using SoCs from Qualcomm and NXP. Includes PCB design, high-speed interfaces, signal and power integrity, thermal analysis, sensor integration, and multi-country certification testing (FCC/IC/CE).
Key Responsibilities
- Gather requirements and finalize architecture for next-gen HMI module with SoCs including Qualcomm and NXP
- Electronics Design & Development; select components and design schematics
- Layout design and high-speed interface guidelines; perform signal integrity, power integrity, and thermal analysis
- Conduct bring-up, functional, EDVT, thermal, and performance testing
- Support certification activities for FCC, IC, CE
Technical Overview
Hardware-focused role requiring deep experience in board-level design, signal integrity, power integrity, and thermal analysis. Regular bring-up and lab testing with compliance to FCC, IC, and CE certifications; cross-functional collaboration with manufacturing.
Ideal Candidate
The ideal candidate is a senior device engineer with 8+ years of hardware design experience, specializing in high-speed interfaces, sensor integration, and regulatory certification (FCC/IC/CE). They should demonstrate strong PCB layout and thermal/power integrity expertise in a manufacturing environment.
Must-Have Skills
Tools & Platforms
Required Skills
Hard Skills
Soft Skills
Certifications
Required
Industry & Role
Keywords for Your Resume
Deal Breakers
Lacks 8+ years of related hardware experience, No experience with FCC/IC/CE certifications, Inability to work onsite in Benton Harbor
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