About this role
Intel is looking for a Fab C4/Bumping Module Engineer in Wafer Packaging Manufacturing to own and sustain factory process modules for 300mm toolsets. The role drives continuous improvement across performance, health, excursions, safety, and output for thick metal/via layers, bumping, reflow, thinning, and backside metallization processes.
Key Responsibilities
- Own sustaining responsibilities for 300mm toolsets and module processes (bumping, reflow, thinning, backside metallization)
- Drive continuous improvement for tool availability, cycle time, defect density, and cost
- Prevent and respond to process excursions using process control systems
- Conduct experiments and materials development/selection to improve process performance
- Deliver robust documentation, training, and transfer of capability to other sites
Technical Overview
You will own one or more factory 300mm toolsets and support module-level development activities including roadmaps, experiments, materials selection, and defect-mode characterization. The job emphasizes process control systems, model-of-record tool performance, and data-driven analysis to improve availability, cycle time, defect density, and cost while ensuring safety and quality.
Ideal Candidate
The ideal candidate is a manufacturing/process engineer focused on semiconductor wafer packaging with strong ownership and data-driven problem-solving skills. They have experience sustaining and improving factory tool modules (e.g., bumping/reflow/thinning/backside metallization) using structured experimentation, process control concepts, and rigorous continuous improvement around availability, cycle time, defect density, safety, quality, and cost.
Must-Have Skills
Solve problems utilizing formal educationself-driven knowledge and upskillingstatistical knowledgeand effective problem-solving tools/methodsStatistical knowledgeTraining others; robust documentation; cogent analysis and presentation of data; thorough transfer to other sites; hardening systems for safetyqualityoutputand cost
Nice-to-Have Skills
Experience defining roadmaps to meet process/product requirementsExperience with module-level development in wafer packaging manufacturingExperience with transfer to other sites and long-term high-volume manufacturing supportExcellent teamwork and leadership skills
Tools & Platforms
process control systemsModel of Record tool performance300mm toolsets
Required Skills
semiconductor wafer processing300mm toolsetsthick metal/via layersbumpingreflowthinningbackside metallizationprocess optimizationequipment configuration changesdesigning and conducting experimentsmaterials development and selectioncharacterization of defect modesstatistical knowledgeprocess control systemstool health and matchingprocess health and matchingexcursion prevention and responseModel of Record tool performancecontinuous improvementtool availabilitycycle timedefect densitydocumentationsafetyqualityoutputcost
Hard Skills
semiconductor wafer processing300mm toolsetsthick metal/via layersbumpingreflowthinningbackside metallizationprocess optimizationequipment configuration changesdesigning and conducting experimentsmaterials development and selectioncharacterization of defect modesdata analysis and presentationprocess control systemsprocess health and matchingexcursion prevention and responsesafetytool health and matchingModel of Record tool performancecontinuous improvement toward tool availabilitycycle timedefect densitycost reductionprocess/product lifecycle: early developmentramp readinessramplong-term high-volume manufacturingdocumentation
Soft Skills
personal ownershipurgency in executiondata-driven mindsetindependent problem solvingteamworkleadershipeffective problem-solving tools/methodstraining othersability to work in a dynamic and ambiguous environmentpartnering with stakeholders in other geographies
Keywords for Your Resume
Fab C4/Bumping Module EngineerWafer Packaging Manufacturing (WPM)semiconductor wafer processing300mm toolsetsbumpingreflowthick metal/via layersthinningbackside metallizationprocess optimizationequipment configuration changesprocess health and matchingtool health and matchingexcursion prevention and responseprocess control systemsModel of Record tool performancecontinuous improvementtool availabilitycycle timedefect densitycostdesigning and conducting experimentsmaterials development and selectioncharacterization of defect modesdata-drivenstatistical knowledgerobust documentationtransfer to other sitessafetyqualityoutput
Deal Breakers
Must be able to solve problems using statistical knowledge and effective problem-solving tools/methods (as stated), Must be willing/able to sustain safety, tool health and matching, process health and matching, and excursion prevention/response responsibilities
Get matched to jobs like this
Luna finds roles that fit your skills and career goals — no endless scrolling required.
Create a Free Profile