Position Details

Type Full-Time

Experience senior

Exp. Years 3 months

Education PhD in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry or related; Minimum 3 months of experience with statistical data analysis, Python or machine learning

Category Engineering (Non-Software)

About this role

Packaging R&D engineer to lead process and material development for advanced substrate packaging that enables disaggregation and heterogeneous integration.

Key Responsibilities

Define equipment configurations and process flow
Plan DOEs
Drive process improvements
Lead cross-functional teams
Collaborate with suppliers

Technical Overview

Strong background in C/C++, Python, Linux, CUDA/OpenCL; experience with materials characterization techniques and DC processes; familiarity with DOE, SPC, and reliability metrics.

Ideal Candidate

The ideal candidate is a PhD-level packaging R&D engineer with strong skills in Python, C/C++, Linux, and high-performance computational methods, able to lead process development and cross-functional collaborations in a semiconductor packaging environment.

Must-Have Skills

PhD degree in Mechanical EngineeringChemical EngineeringMaterials SciencePhysicsChemistry or relatedMinimum 3 months of experience with statistical data analysisPython or machine learning

Nice-to-Have Skills

Engineering troubleshooting and analytical skills on integrated technology issuesExperience owning process tools with knowledge of SPC PCS RFCsExperience with DSCTGAD/TMATitrationICPMSFTIRXPSTOFSIMSEDXSEM

Required Skills

PhD in Mechanical EngineeringChemical EngineeringMaterials SciencePhysicsChemistry or related; 3 months of experience with statistical data analysisPython or machine learning; C and C++; Linux; CUDA; OpenCL; DSC; TGA; D/TMA; ICPMS; FTIR; XPS; TOF-SIMS; EDX; SEM; JMP; JSL

Hard Skills

PythonMachine LearningCC++LinuxCUDAx86 assemblyintrinsicsOpenCL

Soft Skills

Written and verbal communicationTeamworkInterpersonal skillsAbility to work with ambiguityWillingness to travel (<5%)

Industry & Role

Industry Semiconductors

Job Function Lead process and material development for substrate packaging technology

Role Subtype Engineering (Non-Software)

Tech Domains Python, C++, Linux, CUDA, OpenCL, DSC, TGA, ICPMS, SEM

Keywords for Your Resume

Packaging Research and Development EngineerSPTDModule Engineering BackendDOESPCPythonMachine LearningCC++LinuxCUDAOpenCLDSCTGAD/TMAICPMSFTIRXPSTOF-SIMSEDXSEMJMPJSLstatistical data analysisprocess toolsrelational databasePhD in Mechanical EngineeringPyTorchBLASLAPACK

Deal Breakers

Lack of PhD in required fields, No experience with statistical data analysis or Python/machine learning, Inability to travel occasionally

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