✦ Luna Orbit — Engineering (Non-Software)

Module Development Engineer (Adv Packaging)

at Intel

📍 US, Oregon, Hillsboro Hybrid 💰 $133K – $188K USD / year Posted March 13, 2026
Apply Now → ← Browse All Jobs

Position Details

Salary $133K – $188K USD / year
Type Full-Time
Experience mid
Exp. Years 2+ years
Education Bachelor's in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics
Category Engineering (Non-Software)

About this role

This role involves developing and optimizing semiconductor packaging processes, focusing on wafer level assembly and process integration to support manufacturing and future technology roadmaps.

Key Responsibilities

  • Develop manufacturing processes
  • Perform feasibility studies
  • Partner with suppliers
  • Optimize equipment
  • Develop process roadmaps

Technical Overview

The position requires expertise in materials science, process development, equipment metrology, and system design within semiconductor manufacturing, especially in advanced packaging technologies like Thermocompression and Hybrid Bond.

Ideal Candidate

The ideal candidate is a mid-level engineer with 2+ years of experience in semiconductor packaging, wafer level assembly, or process development, with strong technical expertise in materials and process integration.

Must-Have Skills

Bachelor's Degree in Materials Science and EngineeringMechanical EngineeringChemical EngineeringElectrical EngineeringChemistryPhysics3+ years of relevant experienceExperience in wafer level assembly or fab process/hardware technology developmentDirect packaging experience in Thermocompression or Hybrid Bond technology

Nice-to-Have Skills

PhD in relevant fieldExperience with process feasibility studiesKnowledge of industry process trends

Tools & Platforms

Process simulation toolsMetrology equipment

Required Skills

Materials ScienceMechanical EngineeringChemical EngineeringElectrical EngineeringChemistryPhysicsWafer Level AssemblyPackaging TechnologyProcess DevelopmentEquipment MetrologySystem DesignProcess SimulationProcess Integration

Hard Skills

Materials ScienceMechanical EngineeringChemical EngineeringElectrical EngineeringChemistryPhysicsWafer Level AssemblyPackaging TechnologyProcess DevelopmentEquipment MetrologySystem DesignProcess SimulationProcess Integration

Soft Skills

TeamworkProblem-solvingCommunicationCollaborationInnovation

Industry & Role

Industry Semiconductor Manufacturing
Job Function Semiconductor packaging process development and technology innovation

Keywords for Your Resume

Module Development EngineerSemiconductor manufacturingWafer Level AssemblyPackaging technologyProcess developmentEquipment metrologySystem designProcess simulationProcess integrationMaterials ScienceMechanical EngineeringChemical EngineeringElectrical EngineeringChemistryPhysicsHybrid Bond technologyThermocompression

Deal Breakers

Lack of relevant experience in wafer level assembly or packaging, No experience with Thermocompression or Hybrid Bond technology, No relevant engineering degree

Apply for this Position →

Get matched to jobs like this

Luna finds roles that fit your skills and career goals — no endless scrolling required.

Create a Free Profile