About this role
AMD is hiring a Lead Printed Circuit Board (PCB) fabrication process engineer to drive PCB performance, quality, and reliability for datacenter GPU Platform PCBs. The role focuses on high-speed signal and power integrity optimized stacks, process qualification and technology roadmap execution, and closing Design for Manufacturing issues to mitigate fabrication yield risks.
Key Responsibilities
- Design high performance material stacks & complex via-structure interconnects
- Close Design for Manufacturing queries to mitigate fabrication yield issues
- Own process qualification & adoption of PCB fabrication technologies
- Define technology roadmaps and engage vendors to improve performance, cost, and manufacturability
- Collaborate with silicon/package and board engineering teams to deliver package-to-system PCB solutions
Technical Overview
You will define and drive PCB fabrication technology adoption, including process qualification and vendor engagement, to meet SI/PI and Thermal-Mechanical requirements. Responsibilities span designing high performance material stacks and complex via-structure interconnects, addressing Design for Manufacturing queries, and collaborating across silicon/package, board engineering, validation, and failure analysis teams to deliver manufacturable, reliable PCB builds.
Ideal Candidate
The ideal candidate is a lead PCB fabrication process engineer with deep expertise in complex PCB fabrication processes for high-performance, reliable electronics. They have experience owning process qualification and driving Design for Manufacturing closures to mitigate yield issues, particularly for high-speed SI/PI optimized stacks and interconnect structures supporting datacenter GPU Platform PCBs.
Must-Have Skills
drive PCB performancequality and reliability specificationsdesign high performance material stacks & complex via-structure interconnectsaddress/close Design for Manufacturing queries in a timely manner to mitigate fabrication yield issuesown the process qualification & adoption of PCB fabrication technologiesdefine technology roadmapsvendor engagementsand help implement robust architecture design practices
Tools & Platforms
Not specified
Required Skills
PCB fabrication process engineeringsignal integritypower integritypower deliverythermal-mechanical performancedesign for manufacturingfabrication yield mitigationprocess qualificationvendor engagementmanufacturabilityreliability testfailure analysisvia-structure interconnectshigh performance material stacksdatacenter GPU Platform PCBs
Hard Skills
PCB fabrication process engineeringhigh-speed signal integrity (SI) optimized stackspower integrity (PI) optimized stacksinterconnect structures for volume manufacturinghigh performance material stackscomplex via-structure interconnectsDesign for Manufacturing queriesfabrication yield issuesprocess qualification & adoption of PCB fabrication technologiesSignal IntegrityPower DeliveryThermal-Mechanical related performance specificationstechnology roadmapsvendor engagementsrobust architecture design practicesperformancecostmanufacturabilitycollaborate with silicon/package designboard schematics/layout engineeringsystem validationdevice failure analysissupply chain/procurement activitiesassembly reliability testfailure analysesPCB performancequality and reliability specificationsderisk on-schedule delivery of critical buildssignal & power integritydatacenter GPU Platform PCBs
Soft Skills
communicationcollaborative mindsetdetail-orientationinnovative critical problem solving/troubleshootingorganized data collectioncollaboration with key teamsleadership as a Leader in Systems Design Engineering
Keywords for Your Resume
PCB Fabrication Process EngineerLead Printed Circuit Board (PCB) fabrication process engineerhigh-speed signal integritysignal integrity (SI)power integrity (PI)optimized stacksinterconnect structuresvolume manufacturinghigh performance material stacksvia-structure interconnectsDesign for Manufacturingfabrication yieldprocess qualificationPCB fabrication technologiesSignal IntegrityPower DeliveryThermal-Mechanicaltechnology roadmapsvendor engagementsmanufacturabilityperformancecostsilicon/package designboard schematics/layout engineeringdevice failure analysissupply chain/procurementassembly reliability testfailure analysesDatacenter GPU Platform PCBssignal integritypower integrity
Deal Breakers
Must have experience owning PCB process qualification and adoption of PCB fabrication technologies, Must have demonstrated ability to close Design for Manufacturing queries to mitigate fabrication yield issues
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