✦ Luna Orbit — Engineering (Non-Software)

Semi Packaging Engineer

at Analog Devices

📍 US, MA, Wilmington Unknown Posted March 13, 2026
Type Not Specified
Experience entry
Exp. Years 0-1 years
Education Master's degree in Engineering
Category Engineering (Non-Software)

This role involves developing and qualifying semiconductor-based electronic devices, focusing on IC packaging, mechanical and thermal simulations, and manufacturing process documentation.

  • Develop IC packaging solutions
  • Perform mechanical and thermal simulations
  • Manage prototype assembly and qualification
  • Document manufacturing processes
  • Collaborate with quality and reliability teams

The position requires expertise in CAD tools like SolidWorks, FEA software such as ANSYS, and knowledge of semiconductor packaging and reliability testing.

The ideal candidate is a recent master's graduate in Mechanical or Electrical Engineering with hands-on experience in CAD and FEA software, eager to work on semiconductor packaging solutions and manufacturing processes.

Master's degree in EngineeringExperience with 3D CAD toolsExperience with FEA softwareMechanical design fundamentals
Internship in semiconductor IC or electronics assemblyExperience with semiconductor packaging
SolidWorksANSYS
Mechanical EngineeringElectrical Engineering3D CADSolidWorksANSYSFinite Element AnalysisMechanical stress simulationThermal simulationIC packagingManufacturing processQualification testingMaterials scienceMechanical designPrototype assemblyReliability testing
3D CAD toolsSolidWorksFinite Element AnalysisANSYSMechanical designMaterials scienceMechanical engineeringElectrical engineering
CommunicationProblem-solvingLearning mindsetTeamworkTechnical documentation
Industry Manufacturing
Job Function Design and qualify semiconductor IC packages
Mechanical EngineeringElectrical Engineering3D CADSolidWorksANSYSFinite Element AnalysisMechanical stress simulationThermal simulationIC packagingManufacturing processQualification testingMaterials scienceMechanical designPrototype assemblyReliability testingMechanical stressPrototypeQualificationReliabilityManufacturing

Lack of experience with CAD or FEA software, No relevant engineering degree, No internship or experience in semiconductor packaging

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