Position Details
About this role
This role involves developing and qualifying semiconductor-based electronic devices, focusing on IC packaging, mechanical and thermal simulations, and manufacturing process documentation.
Key Responsibilities
- Develop IC packaging solutions
- Perform mechanical and thermal simulations
- Manage prototype assembly and qualification
- Document manufacturing processes
- Collaborate with quality and reliability teams
Technical Overview
The position requires expertise in CAD tools like SolidWorks, FEA software such as ANSYS, and knowledge of semiconductor packaging and reliability testing.
Ideal Candidate
The ideal candidate is a recent master's graduate in Mechanical or Electrical Engineering with hands-on experience in CAD and FEA software, eager to work on semiconductor packaging solutions and manufacturing processes.
Must-Have Skills
Nice-to-Have Skills
Tools & Platforms
Required Skills
Hard Skills
Soft Skills
Industry & Role
Keywords for Your Resume
Deal Breakers
Lack of experience with CAD or FEA software, No relevant engineering degree, No internship or experience in semiconductor packaging
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