✦ Luna Orbit — AI & Machine Learning

Sr. Technical Program Manager, Machine Learning Annapurna

at Amazon.com

📍 US, TX, Austin Unknown Posted March 21, 2026
Type Not Specified
Experience senior
Exp. Years Not specified
Education Not specified
Category AI & Machine Learning

This role involves leading the evaluation and deployment of advanced cooling technologies for AWS's AI hardware platforms, coordinating across engineering, manufacturing, and supply chain teams.

  • Manage thermal program evaluation
  • Lead cross-functional teams
  • Coordinate supply chain
  • Drive thermal technology deployment
  • Ensure reliability and performance

The technical scope includes thermal management, chip packaging, microfluidics, and supply chain coordination, focusing on deploying innovative cooling solutions at scale.

The ideal candidate is a senior program manager with experience in thermal technologies, chip packaging, and supply chain management, capable of leading cross-functional teams in developing advanced cooling solutions for AI hardware platforms.

Program ManagementThermal TechnologiesChip PackagingCross-functional Leadership
Cooling TechnologiesThermal DesignReliability EngineeringManufacturingSupply Chain
Thermal Evaluation ToolsSupply Chain Platforms
Program ManagementThermal TechnologiesChip PackagingMicrofluidicsJet ImpingementTwo-phase CoolingThermal Interface MaterialsSupply Chain ManagementCross-functional Leadership
Program ManagementThermal TechnologiesChip PackagingMicrofluidicsJet ImpingementTwo-phase CoolingThermal Interface MaterialsSupply Chain ManagementCross-functional Leadership
LeadershipCollaborationCommunicationProblem-solvingStrategic Thinking

Preferred

Not Specified
Industry Technology / Hardware / AI & Machine Learning
Job Function Thermal program management for AI hardware
Role Subtype Thermal Program Manager
Tech Domains AI & Machine Learning, Hardware, Thermal Engineering
program managementthermal technologieschip packagingmicrofluidicsjet impingementtwo-phase coolingthermal interface materialssupply chaincross-functional leadershipthermal evaluationcooling technologiesreliability engineeringmanufacturingthermal designAWS

Lack of program management experience, No background in thermal engineering or chip packaging, No supply chain experience, No leadership in cross-functional projects

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