Position Details
About this role
An engineering role focused on designing and qualifying semiconductor packaging solutions, including mechanical and thermal analysis.
Key Responsibilities
- Develop IC packaging solutions
- Perform thermal and mechanical simulations
- Manage project development
- Document manufacturing processes
- Collaborate with global teams
Technical Overview
Involves mechanical design, thermal simulations, and qualification of IC packages using CAD and FEA tools like SolidWorks and ANSYS.
Ideal Candidate
An entry-level engineer with a master's in mechanical, materials, or electrical engineering, experienced in mechanical design, thermal simulations, and CAD tools like SolidWorks and ANSYS. Capable of managing IC packaging projects and collaborating across teams.
Must-Have Skills
Nice-to-Have Skills
Tools & Platforms
Required Skills
Hard Skills
Soft Skills
Industry & Role
Keywords for Your Resume
Deal Breakers
Lack of experience with CAD/FEA tools, No background in semiconductor packaging, No relevant engineering degree
Get matched to jobs like this
Luna finds roles that fit your skills and career goals — no endless scrolling required.
Create a Free Profile