✦ Luna Orbit — Cloud & Infrastructure

Transport Media and Materials Engineer

at Intel

📍 2 Locations Hybrid 💰 $133K – $188K USD / year Posted March 20, 2026
Salary $133K – $188K USD / year
Type Not Specified
Experience mid
Exp. Years 3+ years
Education Bachelor's degree in Packaging Engineering, Mechanical Engineering, or a related field
Category Cloud & Infrastructure

This role involves designing and developing packaging solutions for semiconductor products, supporting logistics, and advancing packaging technology. The engineer will manage projects, conduct materials research, and ensure compliance with standards.

  • Design shipping packaging solutions
  • Develop and validate packaging models
  • Conduct materials research and testing
  • Manage packaging projects and timelines
  • Ensure compliance with shipping and environmental standards

The position requires expertise in packaging design, CAD tools, materials testing, qualification procedures, and project management within semiconductor manufacturing environments.

The ideal candidate is a mid-level packaging engineer with at least 3 years of experience in semiconductor packaging, proficient in CAD tools and materials research. They should have strong project management skills and familiarity with reliability testing and shipping standards.

packaging engineeringCAD softwarematerials researchqualification testingproject management
Master's degree in engineeringsemiconductor packaging experiencepackaging certificationsSix Sigma/Leaninternational shipping regulations
packaging design softwareCAD tools
packaging design softwareCAD toolsmaterials researchqualification testingproject managementreliability accelerationshipping regulationsenvironmental impact
packaging design softwareCAD toolsmaterials researchqualification testingproject managementcost analysisenvironmental impact assessmentproblem solvingreliability accelerationshipping regulations
problem-solvingcollaborativecommunicationinnovationcontinuous improvementanalytical skillsproject managementfamiliarity with standards

Required

CPPIOPP
Industry Semiconductor / Technology Manufacturing
Job Function Design and develop semiconductor packaging solutions
Role Subtype Packaging Engineer
Tech Domains Active Directory, Microsoft 365, Azure, Amazon Web Services, Google Cloud Platform
Clearance Required None
Visa Sponsorship No
packaging design softwareCAD toolsmaterials researchqualification testingproject managementcost analysisenvironmental impactreliability accelerationshipping regulationssemiconductor packagingpackaging engineerlean manufacturingSix Sigmainternational shippinglogisticsproduct developmentpackaging engineeringCAD software

Lack of packaging engineering experience, No CAD or materials research skills, Inability to manage projects, No experience with reliability testing

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